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EFFECT OF SUBSTRATE TEMPERATURE ON THE PROPERTIES OF VACUUM EVAPORATED THIN InSb FILMS

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dc.contributor.author Taher, Md. Abu
dc.date.accessioned 2012-11-08T05:44:46Z
dc.date.accessioned 2019-05-28T09:33:02Z
dc.date.available 2012-11-08T05:44:46Z
dc.date.available 2019-05-28T09:33:02Z
dc.date.issued 2007-01-01
dc.identifier.uri http://hdl.handle.net/20.500.11948/453
dc.description.abstract Indium Antimonide (InSb) thin films were deposited onto well cleaned glass substrate at different substrate temperatures (323K, 373K and 473K) by vacuum evaporation technique using InSb compound as a source material. The characteristics of the films such as composition, microstructure and electrical properties were investigated in terms of substrate temperature. Xray diffraction studies confirmed the polycrystallinity of the films and the films show preferential orientation along the (111) plane. The particle size, dislocation density and strain were evaluated. The particle size increases with the increase of substrate temperature, which was found to be in the range 14.32 to 33.35 nm. Hall measurements indicate that the films were p-type, having carrier concentration W73; 1017cm-3 and Hall mobility (0.42 - 7.10) × 103 cm2/Vs for the film thickness of 300 nm. It is observed that the carrier concentration decreases and Hall mobility increases with the increase of substrate temperature. The sheet resistance is found to decrease with the increase of substrate temperature. The Hall mobility decreased with the increase of the film thickness and the maximum Hall mobility of 1.34 × 104 cm2/Vs was obtained for the films the thickness of 1000 nm and the substrate temperature of 473K. en_US
dc.language.iso en en_US
dc.publisher Daffodil International University en_US
dc.subject Indium antimonide (InSb), thin films, vacuum evaporation, Hall effect, crystal structure, stoichiometry, carrier concentration, Hall mobility. en_US
dc.title EFFECT OF SUBSTRATE TEMPERATURE ON THE PROPERTIES OF VACUUM EVAPORATED THIN InSb FILMS en_US
dc.type Article en_US


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